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Anti-CAF Laminate Material.

Details 

  • >1000 hrs Anti-CAF Under 100V
  • Excellent Insulation
  • Stability After THB
  • Low Water Absorption

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backup.

 

Standard white back up special designed for smooth drill, and rout. thickness is 0.093". cut to the size you want.

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gold plating tape.

Details 

GP-281 gold plating tape is a special designed for high temperature with chemical resistance. It is targeting for immersion Nickel and gold.

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Halogen-Free Laminate.

Details 

  • Halogen & Antimony-free
    Phosphorous Based Epoxy Resin
  • Tg >140 (DSC)
  • Good Thermal Resistance 
  • UL 94 V-0

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HASL CM85.

Details 

Hot air leveling tape is a silcon adhesive base to protect the gold finger, It will stay in the high temperature up to 270 C, It is special designed for Lead Free HASL. It leaves no residue, no leakage, No solvent clean required.

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Immersion Gold.

Details 

ENIG for PCB, We are using UIC immersion Gold process, with 98% close loop DI water system

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Kapton Tape.

Details 

Kapton Tape is a polyimide with silicon adhesive for higher temperature solder reflow.

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laser drill Prepreg.

Details 

* Laser drillable reinforcement * Excellent laser drilling throughput * Smooth surface topography

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Laser Drillable Reinforcement.

Details 

  • Laser Drillable Reinforcement
  • Excellent Laser Drilling Throughput
  • Smooth Surface Topography

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LFHASL.

Details 

Lead free hot air level, SN100CLe solder with Sn/Ni/Cu. for SMOBC & Flex circuits boards

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