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Anti-CAF Laminate Material.
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backup.
Standard white back up special designed for smooth drill, and rout. thickness is 0.093". cut to the size you want.
gold plating tape.
GP-281 gold plating tape is a special designed for high temperature with chemical resistance. It is targeting for immersion Nickel and gold.
Halogen-Free Laminate.
HASL CM85.
Hot air leveling tape is a silcon adhesive base to protect the gold finger, It will stay in the high temperature up to 270 C, It is special designed for Lead Free HASL. It leaves no residue, no leakage, No solvent clean required.
Immersion Gold.
ENIG for PCB, We are using UIC immersion Gold process, with 98% close loop DI water system
Kapton Tape.
Kapton Tape is a polyimide with silicon adhesive for higher temperature solder reflow.
laser drill Prepreg.
* Laser drillable reinforcement * Excellent laser drilling throughput * Smooth surface topography
Laser Drillable Reinforcement.
LFHASL.
Lead free hot air level, SN100CLe solder with Sn/Ni/Cu. for SMOBC & Flex circuits boards
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