CM85 HOT AIR LEVELING TAPE

 

 

Description  : CM85 is a high performance P.C. Board Tape, Providing clean

                      removal on High temperature masking application. It is a flatback

                       paper reinforced with polyester film, combined with an extra

                       aggressive silicon adhesive to withstand the rigors of hot air leveling,

                        excellent chemical and hot solder resistance, good conformability.

 

Application  : Specifically designed to fully protect gold or rhodium plated P.C. board

                       Finger contacts through th flux and high heat of molten solder during

                       Solder coating and hot air leveling.

 

Technical Details:

 

 

                                                                      Standard

Properties               Unit                           Specification                 Test Values

 

Total Thickness        mm (mil)                   0.3(12) + 10%              0.3 (12)

Tensile Strength       Kg / 25mm (lb/1”)     30 (66) min. avg            32 (70.4)

Elongation                %                                 5 min avg                      6

Adhesive to steel      Kg / 25mm(oz/1”)     0.8 (28.5) min. avg       1.2 (42)

Heat Resistance       -                                250 C x 5 second          Excellent

 

 

 

Color           : White

Shelf Lift     : 6 months when storage in original carton at 73 F and 65%

                     relative humidity.

Test Method: In accordance with ASTM D-1000.

Availability : Standard 33m (36 yards) rolls, 77mm(3”) i.d.core, max width

                    914mm(36”)